Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability

Osaka, Japan – Panasonic Corporation announced today that its Industrial Solutions Company has commercialized a semiconductor package substrate material (Product No. R-1515V) enabling both low package warpage and high assembly-level reliability. The newly developed material has very low thermal expansion properties to reduce warping of the substrate during the packaging process and optimized mechanical properties designed to lower the residual stress on solder joints created during reflow assembly. Mass production of the material will start in July 2021.